Market Specific Testing Expertise

Tailored Solutions for Security, Automotive & Mobile Applications

At UTAC Group, we understand that each semiconductor market has distinct performance standards, reliability benchmarks, and regulatory requirements. Our market-specific testing solutions are designed with deep market insight and technical know-how.

Discover how our specialized capabilities and equipment address unique industry challenges across the following application domains:

Highest Security IC
Testing Standards:

Black Box Servers &
Maximum Data Protection

Security ICs require stringent protection of sensitive data and infrastructure. At UTAC Group, we deliver testing solutions that meet the highest industry standards, including EAL6 certification (Evaluation Assurance Level 6), to ensure comprehensive physical and data security across all wafer testing operations. For customers using Black Box servers, we also provide a secure semiconductor testing environment with configurable options tailored to meet specific data protection.

Configurable Black Box Server Testing Infrastructure:

Dedicated High-Security Environment for Black Box Servers

Physically isolated, intrusion-protected room within the test floor.
Multi-factor access control with biometric and keycard authentication.
Tamper-evident, electromagnetically shielded environment for customer Black Box servers.
Continuous CCTV monitoring with 24/7 audit logging for complete traceability.

Secure IT Room Deployment with Controlled Access

Centralized High-Security IT Room with Role-Based Access Control (RBAC).
Strict entry/exit protocols with comprehensive audit trails. Environmental monitoring (temperature, humidity) with redundant power systems.
Advanced connectivity fail-safe infrastructure.

Secure Data Transfer and Program Management

Segregated, firewalled network connections preventing unauthorized access or data leakage.
Dedicated Secure FTP (SFTP/FTPS) channels for all test programs and data transfer.
Hardened data storage systems with ISO 27001 compliance. Stringent data retention policies and secure deletion protocols.

Certified Automotive IC Testing Services:

IATF 16949 Facility with Specialized Thermal Solutions

We provide Package Test (Final Test) and Wafer Testing solutions for automotive-grade semiconductor ICs that power ADAS systems, EV powertrain, body control modules, and in-vehicle infotainment systems.

Tri-Temperature Testing Capability

Comprehensive testing conducted at Cold (-40°C), Room (25°C), and Hot (+150°C)
environments.
Temperature control implemented via advanced thermal chucks for wafer-level testing.
Specialized temperature chambers integrated with handlers for packaged devices.

Automotive Quality IATF 16949 Certification

Fully IATF 16949:2016 automotive quality management certified.
APQP (Advanced Product Quality Planning) and PPAP (Production Part Approval Process)
testing methodologies.
FMEA (Failure Mode and Effects Analysis) and SPC (Statistical Process Control)
integration.

Cold Temperature Testing Expertise

Extensive experience in low-temperature operational challenges, including:

Increased test time due to thermal soak requirements of the probe tip.
Condensation and frost prevention techniques on Test cells, handles, probers and
Probe cards.
Thermal mismatch-induced mechanical stress on sockets, socket pins, probe heads and
probe pins.

Engineering Analysis and DOE-Driven Improvements

Design of Experiments (DOE) methodologies to optimize test parameters.
Root cause analysis for yield loss/improvement under extreme conditions for thermal
stress testing.
Temperature cycling, hot/cold ramp profiling, and device-level monitoring to analyse
behaviour and stress conditions of unit/die under test.

Customizable Test Infrastructure

Flexible handler and prober configurations that support:

High pin-count and high parallelism for digital and mixed-signal devices.
Different Test Hardware docking methodology (Direct Dock, With Pogo Tower, Cable
Dock, etc.)

Expert Mobile (RF and Mixed Signal SoC) Test Solutions:

Wireless Connectivity, Power Management & Signal Integrity Solutions

UTAC Group offers advanced RF and mixed-signal testing capabilities for mobile device SoCs, drawing on extensive experience with products applied in wireless connectivity, battery power management, signal integrity, noise cancelling and touch controllers used in smartphones, wearables, IoT modules, tablets, and wireless peripherals.

Our experienced engineers specialize in high-volume, high-precision mobile IC testing for RF and Mixed Signal devices. Our infrastructure supports both characterization and high-volume production, enabling seamless transitions from NPI to mass deployment in mobile devices.

RF Device Testing Expertise

Proven capability in testing RF front-end and wireless communication IC on
RF-Testers (Teradyne, Cohu, NI-STS and Advantest).
RF test setups include shielded enclosures of Test Loadboards and Hardware to
minimize signal interference.
High-frequency testing capabilities for emerging wireless standards.

Mixed-Signal and Baseband Testing

Functional and parametric testing for Audio codecs, Touch controllers, Display
interfaces, and Sensors.
Expert characterization testing (using customer Test programs) for device Linearity
(INL/DNL), SNR, SINAD, THD, Settling time and bandwidth.
Advanced mixed-signal testers (Teradyne, Advantest) for complex device validation.

Power Management IC (PMIC) Testing

Complete functional and parametric testing for PMICs and battery interface ICs,
LDOs, buck/boost regulators, battery chargers, fuel gauges.

High-Volume Production & Characterization

Integrated ATE test cell solutions for parallel testing, yield optimization, and
cost reduction.
Support for DFT features such as BIST, scan, and boundary scan, using customer
program.

Choose UTAC Group

Ready to leverage our highly comprehensive, high-volume IC testing ATE infrastructure? Our 2,000+ test platforms are configured and waiting to accelerate your semiconductor testing requirements.

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