At UTAC Group, we deliver world-class, end-to-end IC testing services tailored for high-performance, high-reliability applications.
Our dedicated test operations span across Asia, supported by a team of 300+ experienced test engineers. With one of the highest test revenue contributions among OSATs, we are committed to delivering on quality, efficiency, and speed to market.
We support a broad range of end-market applications with tailored test capabilities:
Facilities in Singapore, Thailand, China, and Indonesia, situated near major foundries and bumping/WLCSP lines.
We provide comprehensive testing capabilities across a broad temperature range — from -55 °C to +150 °C for wafer sort and -55 °C to +155 °C for final test. This ensures reliable performance validation for automotive, industrial, and AI/HPC applications.
We operate 2,000+ testers from leading vendors such as Advantest, Teradyne, and Cohu, supported by a wide range of handler technologies that accommodate more than 1,000 types of IC packages.
Leveraging decades of semiconductor manufacturing experience, UTAC Group integrates Industry 4.0 solutions to enhance test operations:
AI-driven predictive maintenance and data optimization for semiconductor yield improvement and operational efficiency.
Deployment of Autonomous Mobile Robots (AMRs), collaborative robots (cobots), and remote-controlled systems.
Collaborations with Optimal+ and Advantest for advanced test analytics, enabling better decision-making, cost efficiency, and yield enhancement.
Provides high-parallel, precision wafer-level test solutions for both standard and singulated wafers at 8” and 12”, with advanced probe card technologies and extreme temperature capabilities (hot and cold testing).
-55°C to +150°C, which is particularly important for automotive customers. For non-automotive applications, the range is room temperature up to +150°. We also offer an air-cooled chuck capability at 25°C +/-1°C.
Wafer probe operations support high parallelism of up to 32 sites for WLCSP and up to 1280 sites for Pad wafers.
UTAC Group utilises fully automated wafer probers from leading manufacturers such as TEL (Precio, PrecioXL, P12/XL, WDF), Accretech (UF3000EX, AP3000e, UF200A/AL), and Semics (SL/SD/SH, SLT, FD12). With advanced ATE test cell integration, these probers enable high-throughput and precision wafer-level testing for logic, mixed-signal, and RF devices across 8″ and 12″ wafers, including sawn wafer probing.
Multiple docking solutions including direct dock, standard hard dock, and cable/soft dock configurations, ensuring compatibility with a wide range of ATE platforms like Teradyne, Invantest, and Cohu.
Experience with a wide range of probe card technologies, including Cantilever, Membrane, Vertical Pin, Pogo Pin, and MEMS. This supports various wafer-level test applications across logic, memory, mixed-signal, and RF devices.
Possesses certified in-house probe card maintenance teams and deep engineering expertise for comprehensive probe card management, encompassing design review, technology selection, maintenance, performance monitoring, and failure analysis. This includes expert knowledge in recipe creation and on-line cleaning methodology.
Using active thermal control (ATC) systems to manage thermal profiles of high-power devices.
Test handlers operate from -55°C to +155°C, crucial for automotive customers. Active Thermal Control (ATC) supports precise temperature management from +130°C to -50°C.
Handlers support up to 16 sites for final test, with some installed handlers supporting up to 32 sites (e.g., NX1032XS).
Includes vision alignment for Pick & Place (PnP) I/O for package sizes from 10x10mm down to 2x2mm.
Includes Pick & Place, Integrated, Gravity, and Film Frame handlers, supporting various package types like QFN, SOT, SO, MLF, CSP, BGA.
Offers various contactor technologies such as Pogo/Mercury Pins (good resistance stability, Pb-free suitable), Standard Array Sockets (solid pin design, excellent electrical performance, higher bandwidth for RF/microwave), Isolated Silicone Contactors, and Pad and Leaded Contactors.
In-house and outsourced screening solutions to eliminate early-life failures, especially critical for automotive-grade ICs.
Verifies real-world device functionality under application-specific conditions to ensure compatibility and reliability.
Product performance evaluation at both wafer and package level, yield optimization, and support for new silicon designs.
UTAC Group has established and optimised manufacturing processes with embedded risk mitigation strategies, ensuring high yield, process stability, and consistent product quality. Our Overall Equipment Efficiency (OEE) of 85% for WS and 75% for Final Test with real-time monitoring.
Features like automated production recipe management, program loading, and paperless manufacturing, along with internally developed scripts for quality control, enhance efficiency. We are developing future-ready processes with hands-free automation, real-time data integration, and autonomous decision-making.
Employs GDBN and PAT (Pattern Analysis Tool) to drive towards zero defects. We have a continuous improvement culture and are certified for stringent security standards (EAL6) and automotive standards (IATF 16949:2016, ISO 9001:2015).
Serves medical, automotive, consumer, industrial, mobile, security, banking, and IoT markets. We have a proven track record in wafer and final test for RF, consumer electronics, automotive, and communication devices, delivering cost-effective and high-throughput solutions.
Engages in long-term partnerships with foundries, probe card suppliers, and major Tester vendors.
Boasts engineers and managers with significant experience in semiconductor test solutions (e.g., >15 years for managers, >10 years for engineers).
Utilises an internally developed OEE system for real-time and historical utilisation data, remote monitoring, and predictive capabilities for hardware, hardware touch down insertion monitoring and other advanced semiconductor testing solutions.
UTAC Group’s centralized test development team supports customers globally, providing robust engineering services to reduce costs, accelerate ramp-up, and optimize test performance.
Over 600 test programs developed and converted across leading ATE platforms.
Whether you’re introducing first silicon, post-silicon validation or scaling high-volume production, UTAC Group’s testing capabilities ensure your ICs meet stringent quality, performance, and reliability standards, faster and more cost-effectively.
Leverage our decades of experience in semiconductor testing. Contact us to learn how UTAC Group can support your next innovation.