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Complete Final Test Services:
Automated Handling & Precision Testing for All Package Types

Ship every semiconductor with confidence with UTAC Group’s advanced automation and reliable precision testing across all our semiconductor manufacturing, automated IC testing and final test services.

Key Final Test

Strip-Based Testing

Strip-Based Testing

  • Film Frame Test
  • Platform
  • Hot Test Film Frame
  • Strip Test Platform
  • Contactor Design
Die Level Traceability

Die Level Traceability

  • Die Trace Data Embed In 2D Barcode On Unit Top Marking
  • 2D Barcode reader embed to STDF (Security product)
Power Discrete Testing

Power Discrete Testing

  • Cu Clip (MOSFET) Test
  • Parallel Index Mode
  • Low Test Time
PAT To Screen Outlier

PAT To Screen Outlier

  • Embedded to MES System to update to Wafer and FF Map
MEMS Testing

MEMS Testing

  • Humidity & Pressure Sensor Test
  • InCarrier Solution for Test-in-Strip

Final Test Capabilities

Pick & Place

  • Tri Temperature (-55-150 C)
  • Up To 32 Test Sites
  • Input : Tray Output : Tray, TnR
Package Dimensions
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>5x5
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5x5 - 3x3
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2x2
(Under evaluate)
Handler List
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SEIKO EPSON NS 6040/ 7080 NS 8080/ 8160
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MT2168XT
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MULTI-TEST 9510
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HONTECH HT-9080A

Gravity

  • Tri Temperature (-55-150 C)
  • Max 8 Test Sites Parallelism
  • Input : Tubes – Output : Tubes, TnR
Package Dimensions
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>5x5
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5x5 - 3x3
Handler List
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SEIKO EPSON NS 6040/ 7080 NS 8080/ 8160
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MULTI-TEST 9510
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MT2168XT

Turret

  • Ambient Temperature
  • 4 Test Sites /8 Test Sites
  • Input : Tubes, Bulk – Output : Tube, TnR
  • Ideal For Low Test Times
Package Dimensions
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>5x5
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5x5 - 3x3
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2x2
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0.3x0.6
Handler List
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NT116/NX116 NY20/NY32
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TD246/XD248 Z244/Z248
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ASM FT-MINI
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EXISTECH HS250/HS300

Film Frame

  • Ambient Temperature
  • High Temp Test 125 C
  • Cold Temp Test (Under Development)
  • Up To 64 test sites
  • Input : Film Frame – Output : TnR
Package Dimensions
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>5x5
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5x5 - 3x3
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2x2
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0.3x0.6
Handler List
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TESEC 3270
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TESEC 4170
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TESEC 5170
(Hot Test Optional)
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Final Test Process Capability

Test Handler Capabilities

High Parallelism

High Parallelism

Up to 32 sites
Temperature range

Temperature range

-55˚C to +155˚C especially for automotive customer
Auto Cleaning

Auto Cleaning

on all sites periodically
Tri-temp ATC

Tri-temp ATC

Active Thermal Control
(+130˚C to -50˚C, max Octal sites).
Longstanding Partnership

Longstanding Partnership

With major platforms vendors

Differentiated Capabilities

Socket and Change Kit Engineering

Socket and Change Kit Engineering

LN2 Pipeline

LN2 Pipeline

For perpetual cooling of Cold Test handler
Small Device Option (SDO)

Small Device Option (SDO)

Vision alignment for Pick and Place I/O from package size below 10x10mm to 2x2mm.
Sort Counter

Sort Counter

Automated quantity tallying during end lot

Test Socket Management

BGA

Standard Array Sockets

  • Floating nest design
  • Precision alignment

Pogo / Mercury Pins

  • Good resistance stability
  • Suitable for Pb-free applications

PAD / LEADED

Pad and Leaded Contactors

  • Solid pin design suitable for QFN/QFP especially RF/microwave device testing
  • Best suited for High-frequency requirements

Isolated Silicone Contactor

  • Excellent Electrical Performance
  • Bigger contact area
  • Higher bandwidth :
    39 ~ 25GHz @ -1dB (S21)
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NS8016MS
50 to 155DegC +/- 3DegC
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HT1028
50 to 155DegC +/- 3DegC
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Delta Matrix- I
-55 to + 155DegC +/- 3DegC
System Level Testing

System Level Testing

Over-Head COBOT

Over-Head COBOT

Over – Head COBOT (Collaborative Robot)
For Open Rack SLT

  • High degrees of freedom arm replacing operator to automate loading/ unloading, trigger test, and segregate tested units.
  • Cold and Room temperature capability.
  • Improved throughput and cycle time.
  • Improved quality by eliminating mechanical defects or misplacement by manual handling.

Background

Leverage UTAC Group's Comprehensive Final Test Capabilities

Partner with UTAC Group for advanced semiconductor final testing solutions designed to meet the diverse needs of today’s semiconductor applications.

Our IC package testing capabilities support a wide range of package types and device categories including power discrete, MEMS, security, and automotive, with a focus on accuracy, efficiency, and quality assurance through every step of the final test process.

CONNECT WITH US TO ELEVATE YOUR FINAL TESTING
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