SEMICON West 2026 brought together semiconductor industry leaders, innovators, and professionals from October 13–15 at the Moscone Center in San Francisco.
The event highlighted emerging technologies and industry developments, including artificial intelligence (AI), advanced packaging, automation, and semiconductor manufacturing.
During the event, Ou Li, Senior Director of Business Development for Advanced Packaging at UTAC Group, joined theCUBE for an on-site interview exploring how AI is accelerating semiconductor innovation, the growing importance of chiplet integration, and the need for greater collaboration across the industry.
Catch the conversation on semiconductor innovation and what’s ahead for the industry: https://www.youtube.com/watch?v=Gw-No-lX4XU
Partner with UTAC Group: https://utacgroup.com/contact-us/