Artificial intelligence is transforming how industries manage power efficiency and performance. As computing demands rise, semiconductor packaging plays a defining role in enabling faster, smarter, and more efficient AI systems.
At PowerUP Expo 2025 (Virtual), Michael Choi, VP of Power and SiP Business Development at UTAC Group, will present:
“Revolutionizing AI Acceleration Power Semiconductor Package: UTAC’s Breakthroughs in Power Packaging — A Journey Through Innovation and Future Development.”
This session explores how UTAC Group is advancing power semiconductor packaging to meet the evolving energy and performance needs of AI-driven systems. Attendees will gain insight into UTAC’s latest packaging architectures, materials innovations, and thermal management solutions that drive both efficiency and scalability across high-power applications. The exponential growth of AI is redefining power requirements across data centers, automotive, industrial, and consumer sectors. This presentation will examine how packaging innovation—from Dual Cool QFN and LGA SiP formats to embedded heat-sink and high-purity copper designs which enables higher power density, superior thermal dissipation, and long-term reliability.
With over two decades of experience in the semiconductor supply chain, Michael Choi is a recognized expert in power supply design and semiconductor applications. A graduate of Seoul National University (B.S. and M.S. in Electrical Engineering), he has contributed to numerous industry advancements and frequently speaks at international power electronics and packaging conferences.
Join UTAC Group at PowerUP Expo 2025 (Virtual)
Be part of the conversation shaping the future of AI-driven power technology.