MiNaPAD 2026 (Micro/Nano-Electronics Packaging, Assembly, Design and Manufacturing Forum) brings together the semiconductor design, assembly, packaging, and manufacturing community for two days of technical discussions, knowledge sharing, and industry collaboration.
The event features technical sessions focused on advanced packaging, heterogeneous integration, semiconductor manufacturing, and next-generation device technologies across a wide range of applications.
As part of the Heterogeneous Integration session, UTAC Group’s Michael Choi will present “Innovative Power Package Solutions for AI GPU Accelerators: UTAC’s Two-sided Cooling SPS, High Thermal EMC, and SiP Power Module Advancements.” The presentation will explore packaging approaches designed to address thermal management, power delivery, and integration challenges in AI and high-performance computing environments.
UTAC Group looks forward to connecting with industry peers and contributing to discussions shaping the future of semiconductor packaging and integration.
Connect with UTAC Group at MiNaPAD 2026 or learn more about our semiconductor packaging and testing capabilities: https://utacgroup.com/contact-us/