IMAPS CHIPcon 2026 brings together leaders across the semiconductor ecosystem to explore the technologies shaping the future of advanced integration. Focused on chiplets, heterogeneous integration, and advanced packaging, the conference examines how the industry is moving from individual components toward increasingly integrated system-level architectures.
The event features technical presentations, industry discussions, and networking opportunities spanning design, packaging, manufacturing, and deployment. This year’s theme, “From Chiplets to System: Architecting the Future of Advanced Integration,” highlights the growing importance of collaboration across the semiconductor value chain.
UTAC Group is proud to participate in CHIPcon 2026, with Scott Jewler serving on the Organizing Committee alongside General Co-Chair Ou Li. We look forward to engaging with industry peers and contributing to conversations shaping the next generation of semiconductor integration and packaging technologies.
Learn more about UTAC Group’s advanced packaging and semiconductor manufacturing capabilities: https://utacgroup.com