UTAC Group participated in the IMAPS 22nd Annual Device Packaging Conference (DPC), held in Phoenix, Arizona, from 2–5 March 2026.
DPC remains one of the industry’s most important gatherings, bringing together engineers, researchers, and business leaders to advance the future of microelectronics packaging.
This year’s conference focused on key themes, including advanced package structures, heterogeneous integration, System-in-Package (SiP), and packaging innovations enabling AI and high-performance computing.
We were pleased to contribute our industry expertise and ongoing research and development efforts through a joint technical paper titled “Packaging Challenges of a Fully Molded Barometer,” presented by Alastair Attard, Director of Business Development, MEMS & Sensors at UTAC Group.
To learn more about UTAC Group’s advanced semiconductor packaging capabilities, visit https://utacgroup.com/packaging/.