Innovations in image sensor packaging must keep up with increasing demand for high-volume manufacturing. Traditional ceramic packages offer strong performance but at prohibitive cost. Laminate-based iBGA packages solved the price problem, but as image sensor die sizes increase, they’re now approaching the reliability and manufacturing efficiency limits of high-volume production.
We are pleased to announce that UTAC Group, a leading global OSAT, will attend the 20th anniversary edition of Image Sensors Europe in London, UK on 17–18 March, 2026 together with leading vision system experts and pioneers.
Join the session with Alastair Attard, UTAC Group Director of Business Development (MEMS & Sensors), at 4:45pm on Tuesday 17th March 2026 for his presentation on a new large body molded image sensor packaging.
This innovative design delivers larger image sensor package sizes, better reliability, performance, and productivity improvements in high volume semiconductor manufacturing.
We look forward to meeting you in London to explore the future of image sensing, together.
Visit Image Sensors Europe Website > https://www.image-sensors.com/image-sensors-europe/agenda?EventId=4047
Explore UTAC Image Sensor Solutions > https://utacgroup.com/packaging/image-sensor/