The 25th European Microelectronics & Packaging Conference (EMPC 2025) brings together industry leaders, researchers, and technology pioneers from September 16-18 to explore the latest advances in packaging technology.
UTAC Group is proud to contribute to this year’s technical program with insights on image sensor packaging. Our Director of Business Development, Alastair Attard, will present “Package and Process Development of Molded Image Sensor Package” during the Optoelectronics session on September 17th from 1:35-3:15 PM.
Join Alastair and our technical team in Grenoble to discuss how advanced packaging solutions can accelerate your imaging technology development.
Learn more about our image sensor capabilities: https://utacgroup.com/packaging/image-sensor/
EMPC 2025 conference details: https://empc2025.org/program/