Scanning Electron Microscopy is the most common and well-known electron microscopy method for the physical imaging of surfaces. The SEM is a powerful and versatile instrument both for inspection and failure analysis. It is a dynamic scanned beam imaging system as opposed to static beam imaging systems such as optical microscopes. SEM is used for inspecting topographies of specimens at very high magnifications, typically up to 30KX. SEM inspection is often used in the analysis of die or package cracks and fracture surfaces, bond failures and physical defects on the die or package surface.