Laser Decap is a dry method of decapsulation, using a high-power laser to ablate the plastic encapsulant material away from a device. Laser decapsulation system is controlled with precision stepper motors to achieve more precise positioning than chemical etching. It is possible to decapsulate devices that would be exceptionally challenging to expose chemically (eg. Cu wire bond) and can do partial/selective decapsulation. If used in combination with chemical etching, yield rate can be greatly improved as contact time with chemicals is reduced.