Decapsulation is a step performed to expose the internal parts of the IC (dies and internal bonding) by removing a portion of mold compound area and depth in preparation for inspection, chemical analysis or electrical examination of the die and the internal features of the package.
This is done without altering the IC’s original electrical characteristics.
Chemical Deprocessing / Etching / Cratering / IMC Test
Destructive Chemical Etch Methods to remove metals and other parts of an IC selectively (eg. Al bond pad layer removal, IMC exposure).