UTAC Group has a comprehensive suite of advanced analysis tools to offer a wide variety of analysis services specially designed to meet our customers’ needs, with a particular focus on challenges relating to process loading reduction, cycle time reduction techniques, and enhanced product yield.
The rapid advancements in flip-chip technology, such as tighter bump pitches and reduced stand-off heights, present increasing challenges in ensuring moldability, particularly when utilizing commercial Moldable Underfill (MUF) during panel-level molding.