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Package Characterization

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UTAC Corporate Analysis Services

With over 15 years of industry leadership, UTAC’s Corporate Research and Development division stands at the forefront of advanced package analysis solutions.
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Your Partner in Packaging Perfection

Imagine having a team of experts armed with cutting-edge simulation tools and a wealth of experience at your disposal. That’s exactly what you get with UTAC Group.

Our state-of-the-art facilities, measurement facilities and archive of 2,000+ in-depth analysis reports ensure we excel in thermal and mechanical analysis, electrical process analysis, FEA simulation, as well as comprehensive process analysis solutions.

VISION & MISSION

We strive to lead the way in advanced packaging technologies, delivering exceptional value to our customers.

By fostering effective cross-functional team collaboration across all our sites, we ensure innovative solutions and unmatched service for our clients through robust product life cycle analysis.

Closed-Loop One-stop Solution for Enhanced Product Yield and Reliability and Cycle Time Reduction Techniques:
Closed-Loop One-stop Solution for Enhanced Product Yield and Reliability and Cycle Time Reduction Techniques:
Background

Why Choose UTAC for Package Characterization?

PACKAGE BEHAVIOR PREDICTION

Stay ahead of potential performance issues with failure prediction and optimization.

UPFRONT DESIGN

Get it right from the start. Design cost-saving strategies that accelerate time-to-market.

DEEP INSIGHTS INTO UNDERLYING PHYSICS

Understand the complexities with integrated chip (IC) assembly insights from our expert analysis.

PROCESS OPTIMIZATION

Streamline for maximum efficiency with process resource optimization for critical applications.

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UTAC Group's Comprehensive Analysis Services

Thermal Analysis Overview
Thermal Analysis Overview

UTAC provides complex IC assembly analysis across a wide range of packages including multi-chip modules (MCM), system-in-package (SiP), memory, Cu-clip, power applications, analog, mixed-signal, WLCSP, and wireless communication technologies.

Thermal Simulation and Measurement Facilities and Services

UTAC offers a comprehensive suite of advanced simulation capabilities and expertise, delivering tailored analysis services designed to meet even the most challenging thermal budgets.

Our dedicated team is committed to providing timely, high-quality solutions that improve thermal management and enhance product yield.

UTAC Thermal Analysis Tools
  • Simulation Simcentre FloTHERM
  • Compact Models
  • Prediction Tools
  • System Level Simulation
UTAC Thermal Analysis Services
  • Package & System Thermal Performance Verification and Comparison
  • Transient Thermal Analysis
  • Package Thermal Solutions
  • Heatsink Thermal Design
  • Compact Models for IC Packages
Mechanical Analysis: Built to Last
Mechanical Analysis: Built to Last

UTAC R&D has accumulated extensive knowledge and experience in both theoretical simulation and experimental characterization.

Our commitment to advanced packaging technologies and analyses is backed by a comprehensive technical library and analysis report expertise.

Whether it’s package or board-level analysis, we’ve got you covered with timely, high-quality solutions for your complex packaging needs.

Mechanical Simulation and Measurement Tools and Services

UTAC Group offers comprehensive mechanical analysis and characterization, focusing on both package and board-level performance and reliability. Our team is dedicated to delivering performance optimization solutions that meet the increasingly complex packaging needs of our customers.

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Mechanical Analysis Summary
Electrical Analysis: Performance Optimization Solutions
Electrical Analysis: Performance Optimization Solutions

UTAC Group provides a diverse range of packaging solutions, including WLCSP, power applications, analog, mixed-signal, and wireless communication packages.

Each package type has unique electrical characteristics that impact signal and power integrity.

To ensure optimal interconnect performance, device-specific electrical modeling and characterization are essential. UTAC Group’s expertise and advanced simulation capabilities are designed to meet the evolving demands of modern packaging solutions, including cutting-edge technologies. Our electrical analysis encompasses the entire process—from pre-layout design and optimization to package performance verification and reliability assessment.

Electrical Simulation and Measurement Tools and Services

UTAC Group offers comprehensive electrical analysis and characterization services across a wide range of applications.

Our simulation capabilities include low and high-frequency analysis, power and signal integrity, impedance matching, and full-wave analysis, ensuring optimal performance based on complex IC assembly analysis.

UTAC Electrical Analysis Tools
  • Quasi-static parasitic extraction (RLC)
  • S-parameter analysis
  • Equivalent circuit model
  • Cross-talk / coupling analysis
  • Impedance control / analysis
  • Power integrity analysis
  • Substrate / PCB signal integrity analysis
  • TDR measurement
  • Failure isolation
UTAC Electrical Analysis Services
  • E-field distribution
  • RLC matrix
  • S-parameter data
  • Trace impedance
  • matching / control
  • PDN analysis (IR drop, current density, resonance, and impedance profile)
  • Time-domain SI analysis (x-talk, delay, ringing, reflection, eye diagram)
  • SPICE model
  • IBIS package model
Moldflow Analysis: Perfecting the Process
Moldflow Analysis: Perfecting the Process

UTAC Group has a comprehensive suite of advanced analysis tools to offer a wide variety of analysis services specially designed to meet our customers’ needs, with a particular focus on challenges relating to process loading reduction, cycle time reduction techniques, and enhanced product yield.

The rapid advancements in flip-chip technology, such as tighter bump pitches and reduced stand-off heights, present increasing challenges in ensuring moldability, particularly when utilizing commercial Moldable Underfill (MUF) during panel-level molding.

Eliminate Package Characterization Bottlenecks

A critical issue I package characterization is severe void entrapment beneath the die.

Traditionally, resolving this problem involves extensive experiments with a large Design of Experiments (DOE) matrix, demanding substantial time and resources.

To mitigate this, we design cost-saving strategies with UTAC 3D moldflow simulation – offering you a strategic approach for optimizing design, material selection, and molding processes for process loading reduction.

By utilizing moldflow simulation, UTAC effectively reduces defects and minimize the DOE matrix required for empirical testing.

This simulation technology not only shortens the design-to-implementation cycle but also facilitates the early identification of key issues during the design phase.

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Moldflow Analysis Summary