At UTAC Group, our Design Centers bring together experienced engineers to provide comprehensive, one-stop design services across a broad range of product offerings. These include Leadless Packages, Bump Mask, Wafer-Level Packages, System-in-Package (SiP), Laminate Packages, and Leaded Packages.
To complement our packaging solutions, we leverage state-of-the-art design and package characterization capabilities, enabling customers to achieve their performance and cost goals. Our engineering teams work closely with customers, employing advanced design and simulation tools to accelerate the design process and ensure the solution is right the first time.
Once the design is approved, our proven project management methodology guides new product introduction through a rigorous phase-gate process, ensuring smooth and efficient qualification.
UTAC utilizes a wide range of industry-leading design tools, enhanced by our proprietary customizations to improve accuracy, streamline integration, and reduce design cycles. Our toolset includes:
Our design expertise spans a wide array of IC package and module applications, including:
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