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UTAC Design Services:

Driving Innovation in IC Packaging

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At UTAC Group, our Design Centers bring together experienced engineers to provide comprehensive, one-stop design services across a broad range of product offerings. These include Leadless Packages, Bump Mask, Wafer-Level Packages, System-in-Package (SiP), Laminate Packages, and Leaded Packages.

Advanced Capabilities for Performance and Cost Optimization

To complement our packaging solutions, we leverage state-of-the-art design and package characterization capabilities, enabling customers to achieve their performance and cost goals. Our engineering teams work closely with customers, employing advanced design and simulation tools to accelerate the design process and ensure the solution is right the first time.

Once the design is approved, our proven project management methodology guides new product introduction through a rigorous phase-gate process, ensuring smooth and efficient qualification.

Comprehensive Design Tools and Customizations

UTAC utilizes a wide range of industry-leading design tools, enhanced by our proprietary customizations to improve accuracy, streamline integration, and reduce design cycles. Our toolset includes:

Cadence Allegro Advanced Package Designer (APD) Logo
Cadence Allegro Advanced Package Designer (APD)
Downstream CAM350 Logo
Downstream CAM350
AutoCAD - Mechanical Logo
AutoCAD - Mechanical
GDSII viewers and translation tools Logo
GDSII viewers and translation tools
These tools are augmented by internal innovations that enhance design precision and efficiency.

Expertise Across Diverse Applications

Our design expertise spans a wide array of IC package and module applications, including:

  • Flip Chip Packages
  • System-in-Packages (SiP) & Modules
  • Broadband & Communication IC Packages (e.g., FBGA, QFP)
  • Wireless & RF Packages (e.g., QFN, FBGA)
  • Mixed-Signal Packages (e.g., FBGA, QFP, Flip Chip BGA)
  • Analog & Standard Logic Packages (e.g., QFN, DFN)
  • Image Sensors & MEMS
  • Power Packages with Cu Clips
  • Bumping & Wafer-Level Chip-Scale Packages (WLCSP)
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At UTAC, we deliver cutting-edge IC package designs tailored to meet the evolving needs of our customers, ensuring high performance, reliability, and cost-effectiveness.

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