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Power

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Powering Tomorrow's Innovations

Next-Generation Power Products for a Smart, Sustainable Future

Packaging Solutions for Power Semiconductor Needs

System Level Target

Higher Efficiency
Higher Efficiency
Technical Goal:

Reduce Conduction losses
Reduce switching losses

Enabling Package Technology:

Thin wafer (50-75um)
From wire bond to Cu Clip

Increased Power Density
Increased Power Density
Technical Goal:

Small form factor
Higher Current

Enabling Package Technology:
  • Thick lead frame
  • Passive Integration
  • Die and Clip stacking
Higher Thermal Performance
Higher Thermal Performance
Technical Goal:

Better transient and steady
state thermal characteristics

Enabling Package Technology:

Dual/top-side cooling
New materials (die attach & molding)

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Smart Power Stage

Smart Power stage consist of Driver IC and 2 MOSFETs into one QFN

In AI and server Smart Power stage, form factor and heat dissipation are important

Single Cu Clip side-by-side QFN module

  • Wire bonded Driver IC + Cu Clip for MOSFETs
  • Side-by-side Driver IC + 2x MOSFETs
  • 3x DAPs (for Driver IC + 2x MOSFETs)
  • QFN 5×5 & 5×6 are popular packages

Stack-on-Clip QFN Module

  • Stacked Driver IC on MOSFETs Cu Clip
  • 2x DAPs (for 2x MOSFETs) -> smaller body
  • 3QFN 4×5 and 4×6 offer space saving for high density power

Smart Power Stage Exposed Heat Slug

Power packages with external heatsink provide the necessary thermal performance for HPC applications

Smart Power Stage Exposed Heat Slug Smart Power Stage Exposed Heat Slug
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Enhanced heat dissipation compared to traditional molded packages
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Direct thermal dissipation path from die to package surface
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Optimized external cooling methods for package top side (heatsinks, cold plates)
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Majority of power dissipation occurs through exposed heat slug and external heatsink
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Optimal performance and reliability for high-power applications

Thermal Enhancement
for Power QFN Package

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UTAC's Power QFN packages combine high thermal conductivity mold compounds with advanced copper alloy clips, significantly enhancing both thermal efficiency and electrical performance.
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Our expertise in QFN copper clip development and manufacturing is well-established, with a projected cumulative volume of 3 billion QFN units with copper clips by 2024.

Package Perspective

Our advanced package design significantly reduces thermal resistance, optimizing heat dissipation from both package to PCB and package to heat sink:

Package to PCB
Heat Dissipation:

  • Bottom exposed pad efficiently dissipates power to PCB
    Bottom exposed pad efficiently dissipates power to PCB
  • High thermal conductivity die attach materials enhance heat transfer to exposed pad
    High thermal conductivity die attach materials enhance heat transfer to exposed pad

Package to Heat Sink
Thermal Management:

  • Exposed Cu clip with heat slug on package top side
    Exposed Cu clip with heat slug on package top side
  • Efficient thermal dissipation path to external heat sink
    Efficient thermal dissipation path to external heat sink
  • The exposed copper clip and heat slug cover 25% of the package's top mold area, offering excellent thermal conductivity
    The exposed copper clip and heat slug cover 25% of the package's top mold area, offering excellent thermal conductivity
  • High thermal conductivity mold compounds (3 & 5 W/mK) further improve heat dissipation to heat sink
    High thermal conductivity mold compounds (3 & 5 W/mK) further improve heat dissipation to heat sink
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SiC Wafer Dicing

Ultrasonic-Wave Blade Dicing

Advantages
  • Minimizes top and bottom – side metal chipping
  • Improves sidewall quality
  • Reduces sidewall cracking
  • Optimized for hard-to-cut materials like SiC, offering higher UPH

GaN Wafer Dicing

Laser Groove and Blade Dicing

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Partner with UTAC for Industrial electronics semiconductor testing and packaging solutions.

Contact us today to explore how our industrial automation solutions can maximize your performance and operational efficiency.

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