Next-Generation Power Products for a Smart, Sustainable Future
Reduce Conduction losses
Reduce switching losses
Thin wafer (50-75um)
From wire bond to Cu Clip
Small form factor
Higher Current
Better transient and steady
state thermal characteristics
Dual/top-side cooling
New materials (die attach & molding)
Smart Power stage consist of Driver IC and 2 MOSFETs into one QFN
In AI and server Smart Power stage, form factor and heat dissipation are important
Power packages with external heatsink provide the necessary thermal performance for HPC applications
Our advanced package design significantly reduces thermal resistance, optimizing heat dissipation from both package to PCB and package to heat sink: