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Mems & Sensors

MEMS & Sensors
Packaging Solutions

MEMS and Sensors have become ubiquitous, embedded in everything from motion sensors in smartphones, altimeters in smartwatches, magnetic position sensors for industrial motors and engine management sensors for internal combustion engines, to current sensors for electrical vehicle drivetrains, and MEMS timing for high performance computing and wireless communications.

At UTAC, we provide semiconductor packaging solutions that ensure these MEMS/Sensor devices perform reliably over their lifetime while maintaining small form factor and without introducing any drift.

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Our MEMS & Sensor Production Process

MEMS & Sensor devices’ performance is highly dependent on both the operating principle as well as the packaging used to house the dies. Our advanced packaging capabilities for MEMS & Sensor guarantee device performance whilst being scalable at high volume with fast time to market – all without compromising on durability and reliability.

For this reason, it is often the case that custom packaging and testing solutions are required for different MEMS & Sensor devices.

UTAC Group R&D teams collaborate closely with customers to develop the correct package design and select materials that strike the perfect balance between performance, reliability, size and cost.

With more than a decade of experience, we have broadened our MEMS & Sensor portfolio significantly to include diverse package structures and Bill of Materials, ensuring our solutions cater for numerous MEMS & sensing applications.

Today, we have many different device types running in high volume production, as well as many new products in development, in an assortment of package types, body sizes, multi-die layouts, and material types.

Leaded Package
(e.g SOIC)
Leaded Package
(e.g SOIC)
QFN
QFN
GQFN
GQFN
Overmolded
QFN/LGA
Overmolded
QFN/LGA
Exposed Die
QFN/LGA
Exposed Die
QFN/LGA
Cavity LGA/MIS
with LID
Cavity LGA/MIS
with LID
Ceramic
Cavity
Ceramic
Cavity
Hermetic
Ceramic Cavity
Hermetic
Ceramic Cavity
Automotive industry

Automotive industry

High-reliability packaging solutions for ADAS, Electrification, and User Comfort/Experience.
Consumer Electronics

Consumer Electronics

Miniaturized designs for wearables and smartphones.
Industrial Systems

Industrial Systems

Precision sensors for motors, current management, and more.
Comprehensive Portfolio of MEMS & Sensor Packages

Comprehensive Portfolio of MEMS & Sensor Packages

Device Types Supported

Accelerometers & gyroscopes (standalone and combo units)
Accelerometers & gyroscopes (standalone and combo units)
Pressure sensors (barometric, waterproof)
Pressure sensors (barometric, waterproof)
Gas, humidity and temperature sensors
Gas, humidity and temperature sensors
Magnetic position and current sensors
Magnetic position and current sensors
Fluidic sensors
Fluidic sensors
RF MEMS
RF MEMS
Automotive Focus

Automotive Focus

Our packaging solutions meet the critical reliability criteria of automotive-grade devices, including extended AEC-Q100 Grade 0 reliability and ASIL D requirements.
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Automotive Sensors by Applications

  • ADAS/ADS
  • Comfort
  • Safety
  • Powertrain(ICE/xEV)
  • ADAS / Safety / Powertrain / Comfort
Automotive Sensors by Applications

Key Enabling Technologies for MEMS & Sensor Packaging

Category
Enabling Technology
Benefit
Package
Structure
Broad platform of packages from fully overloaded, exposed die/cavity insert molded, and ceramic cavity.
Customized package structure based on sensor requirements, with possibility to expose sensor to environment and minimize package stress to improve performance.
Carrier
Types
Laminate, lead frame, routable lead frame and ceramic substrate options.
Carrier selection for design flexibility and targeted device performance and reliability.
Bill of
Materials
Wide BOM library including low modulus adhesives, DAF/FOW laminated films, gel fill and tuned mold compounds.
Optimum material selection to mitigate package stress, reduce form factor, and meet device mission profile.
Wafer
Preparation
Capability for thin wafer back grinding, laser grooving, and dry wafer dicing processes such as stealth and plasma dicing.
Allowing for thinner die to reduce package thickness and dry wafer singulation processes for MEMs with fragile structures.
Die & Component
Placement
Supporting die and SMT component attach, including high BLT and flip chip options.
For higher package integration (SiP), enhanced functionality and performance, and package size reduction.
Encapsulation
Options
Transfer and compression molding capability for molded packages, and lid attach with hermetic sealing option for cavity packages.
Various encapsulation options to support required package structure, device function, and reliability requirements.
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Expertise in MEMS & Sensor Testing

Beyond packaging, we also apply our vast test experience to MEMS & Sensor testing.

Our capabilities support both wafer probing and MEMS & Sensor final part testing, specifically addressing the key challenges of stimuli application and sensor calibration.

Test Capabilities

With a variety of testers from leading ATEs, and test handlers with different manipulation methods, we provide comprehensive turnkey packaging and testing solutions for our customers across a wide range of MEMS & sensor applications, including magnetic, current, pressure, fluidic, gas, and optical sensors amongst others.

Test Capabilities

Why UTAC for MEMS & Sensor Packaging?

Tailored Solutions

Tailored Solutions

Customizable designs to meet application-specific requirements.

Reliability Assurance

Reliability Assurance

Reliable packaging that maintains sensor performance over time without drift.

Scalability

Scalability

High-volume production capabilities with fast time-to-market.

Comprehensive Support

Comprehensive Support

From design and material selection, to assembly, testing and calibration.

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Ready to Build Your MEMS & Sensor Solution?

UTAC is a trusted partner for companies seeking to elevate their MEMS and sensor devices with robust packaging and testing services.

Whether you’re innovating in automotive, consumer electronics, or industrial systems, our MEMS & Sensor expertise will ensure your devices’ performance over their lifetime.

Request a Quote