Background Image
Back to Packaging

Leadframe

Pioneering Leadframe
Packaging Solutions

UTAC Group, a leader in semiconductor assembly and testing, offers cutting-edge leadframe packaging solutions tailored to meet diverse industry needs.

With a strong focus on electrical & thermal performance, efficiency, and innovation, UTAC Group provides a comprehensive range of lead frame packaging technologies that cater to high-performance applications in industrial, telecommunications infrastructure, consumer electronics, and automotive markets.

Key Leadframe Packaging Offerings

Key Leadframe Packaging Offerings

QFN Cu Clip

Copper Clip technology is a preferred alternative to traditional wire bonding for high-performance MOSFETs. As a market leader in MOSFET packaging, UTAC Group produces a wide array of QFN Cu Clip packaging to support leading IDMs and fabless companies.

QFN Cu Clip

Features and Benefits:

  • Fully automated assembly with thin wafer mount and Taiko ring cut/removal capability.
  • In-line die attach, clip attach and reflow systems for high process control, yields and device reliability.
  • Side-by-side and stacked multi-chip and multi-clip configuration capability for advanced DrMOS and Smart Power Stage products.
  • Dual side cooling and high thermal conductivity mold compounds for improved thermal dissipation.
  • Significant performance advantages:
    • Lower interconnect resistance and inductance.
    • Enhanced current handling capability.
    • Improved thermal performance (transient and steady-state).
  • Target Applications: High-end computing (servers, data centers), telecom infrastructure, laptops, graphics cards, and automotive systems.

Features

  • Standard package thickness: Options ranging from 0.33mm to 1.00mm, with options < 0.3mm for ultra thin devices and > 1.0mm for SiP QFN.
  • Halogen-free and RoHS-compliant materials.
  • Advanced configurations: Multi-chip (side-by-side and stacked die), Flip-Chip (Cu Pillar & solder bump), exposed die flip-chip, SiP, and more.
  • Lead finish: Matte Tin & pre-plated leadframe (PPF) with various wettable flank options (immersion tin, step-cut and dimple).
  • End Applications: Automotive, consumer electronics, and compact devices.

QFN, DFN, and Dual-row QFN

The Quad Flat No-Lead (QFN) package, introduced by UTAC Group in 1998, is a popular lead-less package.

QFN is an ideal cost-effective solution for high-speed applications requiring high thermal and electrical performance with small form factors.
QFN, DFN, and Dual-row QFN

TLA (Thermal Leadless Array)

TLA is a multi-row lead frame package, which uses advanced leadframes and assembly processes to offer a higher I/O density solution with exceptional thermal performance and smaller footprint than conventional leadframe packages.

TLA (Thermal Leadless Array)

Features

  • Customizable designs to fit specific die requirements.
  • Package thickness as low as 0.33mm.
  • Bussless design with no exposed copper on sidewalls.
  • Compatible with MSL Level 1 standards.
  • Applications: Compact, thermally intensive products across industrial and consumer markets.
Background

QFP (Quad Flat Package)

UTAC’s QFP offerings include QFP, LQFP (Low-Profile Quad Flat Package) and TQFP (Thin Quad Flat Package) in various sizes and lead counts per JEDEC standards.

These packages are suited for applications requiring higher I/O count devices requiring high thermal, electrical and reliability performance.

QFP (Quad Flat Package)

Options and Enhancements:

Icon
Exposed die attach pad for better thermal management.
Icon
Advanced wire bonding options including copper bonding wire.
Icon
Stacked die capability for increased integration and functionality.

Diverse Leadframe
Package Offerings

UTAC offers a wide range of leadframe-based packaging solutions tailored for specific requirements:

SOIC

SOIC

Cost-effective industry standard package in both narrow and wide body formats, and exposed pad option.

HSSOP, TSSOP, QSOP, MSOP

HSSOP, TSSOP, QSOP, MSOP

Denser leaded packages with narrower lead pitches, including ultra-thin and exposed pad package options.

SOT and SC Packages

SOT and SC Packages

Ideal for low pin count, small form-factor designs, including SOT23, TSOT23, and SC70.

Why Choose UTAC?

UTAC Group’s commitment to innovation, quality, and performance ensures that every leadframe packaging solution meets the highest standards of reliability and efficiency in semiconductor assembly services.

With decades of experience and a proven track record in supporting leading IDMs and fabless companies, UTAC Group is the partner of choice for cutting-edge semiconductor packaging needs and turnkey assembly and test solutions.

Image Image

Partner with UTAC for Advanced Leadframe Solutions

Explore how UTAC Group’s leadframe packaging solutions can elevate your product performance and drive innovation in your industry.

Request a Quote
×