FCCSP

Engineering Flip-Chip Chip-Scale Packaging Excellence

FCCSP stands for Flip-Chip Chip-Scale Package. It is a type of semiconductor packaging technology that combines flip-chip bonding with the benefits of a chip-scale package (CSP).

FCCSP is widely used in applications requiring compact, high-performance, and high-density packaging, such as in mobile devices, consumer electronics, and high-speed computing.

Key Features of FCCSP Packaging

Explore the advanced technical features that make flip chip integration an optimal choice for high-performance applications.

Flip-Chip Bonding

The semiconductor die is flipped upside down so that its active surface (where the input/output (I/O) pads are located) faces the substrate.
Tiny solder bumps on the die make direct electrical connections to the substrate, eliminating the need for wire bonding.

Chip-Scale Package (CSP)

CSP refers to packages that are nearly the same size as the chip itself, offering a compact and lightweight design.
FCCSP achieves a small form factor ideal for space-constrained devices.

Multilayer Substrate

Typically, a laminate substrate is used in Flip Chip CSP (FCCSP), providing electrical routing and mechanical support.
The substrate often includes multiple layers to handle high I/O density and complex signal routing.

Encapsulation

After assembly, the chip and substrate are encapsulated to protect the solder joints and chip from mechanical and environmental stresses.

Ball Grid Array (BGA) Interface

The package uses an array of solder balls on the bottom of the substrate to connect to the printed circuit board (PCB).

How FCCSP is Used

Whether you’re developing solutions for automotive, mobile, computing, or industrial applications, our experienced team will work closely with you to optimize your package design and manufacturing process.

Assembly Process

The flip-chip die is placed on the substrate, and the solder bumps are reflowed to establish electrical and mechanical connections.
Underfill material is added between the die and substrate to enhance mechanical reliability and thermal stability.

Electrical Interconnections

Electrical signals are routed through the solder bumps to the substrate, then through the substrate to the BGA, which interfaces with the PCB.

Thermal Management

FCCSP allows for better heat dissipation compared to traditional wire-bond packages because the flipped die ensures shorter electrical paths and closer contact to the substrate.