Process and Design Optimization of Lead-frame Packages for Molded Underfill Process Through Mold Flow Simulation Authors: Daniel Ting Lee Teh, Jun Dimaano, Preecha Joymak, Apinan Seetao, Kunawut Noisorn
The 1-up strip warpage control of lead frame package Authors: Gu Bin, Jun Dimaano, Seow Fui Shi, Dr Nathapong Suthiwongsunthorn
GaN packages’ performance study utilizing FEM Analysis and actual assembly build for validation Authors: Kyaw Ko Lwin, Jun Dimaano, T.L Teh Daniel, Carolyn E.T, Dr. Nathapong S, Saravuth S
