Semiconductor manufacturing in the high-performance computing market is characterized by rapid innovation and diversification, driven by the growing demand for energy-efficient and application-specific computing.
We work with our customers to provide power-efficient, high performance computing devices with advanced thermal management solutions, such as dual side cooling, to power the latest generation of servers.
Our semiconductor manufacturing and packaging solutions address the sensing and actuation applications necessary for thermal management and precision timing solutions in advanced server solutions.
We also provide highly advanced and extensive automated system level testing for critical devices deployed in data center technology and servers.
UTAC is a leading provider of power semiconductor packages with over 2 billion units of Cu clip devices shipped by 2023, with most of these used in the high-performance computing market. This number continues to grow with the demand for AI server applications and advanced computing systems with high thermal performance.
High performance computing needs tremendous amounts of power, reliability, and efficient thermal management.
