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Computing
Power Unleashed

As emerging applications of new technologies like AI, cloud computing, and advanced networking become increasingly widespread, semiconductors continue to play a critical role in shaping the future of computing.

Semiconductor manufacturing in the high-performance computing market is characterized by rapid innovation and diversification, driven by the growing demand for energy-efficient and application-specific computing.

Key Market Trend

Rapid innovation in AI and machine learning
Rapid innovation in AI and machine learning
Expansion of cloud computing and edge computing infrastructure
Expansion of cloud computing and edge computing infrastructure
Growing demand for energy-efficient advanced computing systems
Growing demand for energy-efficient advanced computing systems
Advancements in quantum computing and neuromorphic chips
Advancements in quantum computing and neuromorphic chips
Computing Devices at UTAC

Computing Devices at UTAC

UTAC supports the computing industry with advanced semiconductor packaging, and testing solutions for PCs, laptops, data center technology and AI servers.

PCs and laptops

  • Solutions for analog, logic, power management, sensing and communication components.
  • Compact form factor packages (WLCSP, QFN and BGA/LGA).
PCs and laptops

Cloud Computing And AI

We work with our customers to provide power-efficient, high performance computing devices with advanced thermal management solutions, such as dual side cooling, to power the latest generation of servers.

Cloud Computing And AI

Packaging Solutions

Our semiconductor manufacturing and packaging solutions address the sensing and actuation applications necessary for thermal management and precision timing solutions in advanced server solutions.

We also provide highly advanced and extensive automated system level testing for critical devices deployed in data center technology and servers.

Packaging Solutions
The UTAC Edge

The UTAC Edge

UTAC is a leading provider of power semiconductor packages with over 2 billion units of Cu clip devices shipped by 2023, with most of these used in the high-performance computing market. This number continues to grow with the demand for AI server applications and advanced computing systems with high thermal performance.

High performance computing needs tremendous amounts of power, reliability, and efficient thermal management.

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Proven Semiconductor Manufacturing Expertise
Proven Semiconductor Manufacturing Expertise
  • Power QFN and Cu clip packages
  • Dual sided cooling solutions
  • Power SiP packages
Advanced MEMS Packaging Technologies
Advanced MEMS Packaging Technologies
  • Latest generation high precision MEMS based timing devices.
World Class Testing Capability
World Class Testing Capability
  • High end wafer sorting capability
  • Known good die (KGD) process flows
  • System level testing for advanced wafer technology nodes

Partner with UTAC

For trusted semiconductor manufacturing expertise and integrated circuit technology in the fast-evolving world of AI server solutions, data center technology, and high-performance computing.

Contact us today to optimize your computing infrastructure’s power efficiency, thermal performance, and reliability.
Connect with UTAC