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Connecting
the World

In a world increasingly reliant on wireless communication devices and mobile connectivity solutions, from smartphones to networking infrastructure, semiconductor solutions are driving the technology behind a wide range of applications.

From Smartphones to Satellites, Communication Tech Keeps Us Connected Image

From Smartphones to Satellites, Communication Tech Keeps Us Connected

The communications market is characterized by rapid evolution, driven by the need for higher data rates, lower latency, and more efficient power management.

As demand for faster, more reliable, and secure communication grows, the semiconductor industry is continuously innovating with advancements across wired and wireless communication devices, optical, network infrastructure, mobile connectivity solutions, IoT and 5G applications and satellite communications.

Communication
Devices at UTAC

UTAC Group is highly active in the communications IC market, providing advanced semiconductor packaging for smartphones and infrastructure applications.

Our expertise in high-frequency packaging solutions spans the entire communications ecosystem of consumer devices and infrastructure applications.

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Mobile and Handheld Applications

RF modules (e.g. Bluetooth, WiFi, and 5G)
RF modules (e.g. Bluetooth, WiFi, and 5G)
Power management ICs (PMICs)
Power management ICs (PMICs)
MEMS and sensors
MEMS and sensors
Audio/video controllers
Audio/video controllers
Secure elements
Secure elements
Interface ICs
Interface ICs

Infrastructure

  • Wired and wireless communication devices
  • High data rate wired communication ICs
  • RF GaN devices for high power & high frequency wireless communication
  • Precision timing solutions
  • Power management deployed in telecoms infrastructure (e.g. 5G base stations)
Infrastructure

Advanced Semiconductor Solutions for Smartphone Innovation

We leverage our long-standing expertise in wafer sort and wafer level packaging to address many smartphone applications for major smartphone OEMs:

Advanced Semiconductor Solutions for Smartphone Innovation

For power and RF applications requiring excellent thermal dissipation and low-loss, high frequency operation.

Flip chip on lead frame (fcQFN/fcMIS) and laminate (FCCSP, FCBGA)

For high frequency applications due to their lower parasitic inductance and capacitance.

SiP and MEMS/Sensor capabilities

For highly integrated modules and sensor applications.

The UTAC Edge

The UTAC Edge

One of UTAC Group’s key value propositions is our ability to act as a one-stop shop. Our full turnkey services include:

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One-stop Shop:

From bumping, wafer sorting, assembly and final test.

Singapore Hub:

We can offer the entire flow for wafer level packaging in a location renowned for its high engineering expertise, geopolitical stability and supply chain resilience.

Smartphone OEM Expertise:

Our expertise and quality standards meet the stringent performance and quality criteria required for devices destined for flagship smartphones.

Adoption of Advanced Technologies:
  • Stealth and plasma dicing, aimed at process quality improvement, drive device miniaturization, and increasing die count per wafer.
  • Extensive MEMS portfolio covering numerous smartphone sensors,includingdsinertial and pressure sensors.
Comprehensive Testing Capabilities:
  • Sawn wafer/panel testing.
  • Single unit WLCSP test for wafer level device.
  • RF testing capability for final part testing of communication ICs at high frequencies.
Full device traceability across the entire manufacturing flow:
  • Allows identification of which dies have been used in a specific package.
  • Ability to link assembly and testing steps for tracking and test optimization.
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Partner with UTAC

for advanced semiconductor packaging and high-frequency packaging solutions for smartphones, infrastructure applications and IoT connectivity technology.

Contact us today to enhance your device performance, optimize your testing processes, and meet the growing demands of the global communication market.
Enquire Now