ISES USA 2025’s focus on “AI-Powered Innovation: Driving the Next Wave of Semiconductor Breakthroughs” promises to illuminate new advanced packaging challenges for AI applications amidst rising demand as AI and semiconductor manufacturing technology converge, highlighting the critical role of IC assembly and packaging in enabling next-generation AI capabilities.
As chip manufacturers seek reliable, high-performance computing applications for their most advanced designs, UTAC Group continues to strengthen our position as a trusted partner in semiconductor packaging and testing solutions for AI semiconductor companies.