The Heterogeneous Integration (Advanced Packaging) International Conference (HIIC) 2025 will focus on the growing demand for computing power driven by Generative AI and HPC applications. As traditional transistor scaling becomes insufficient, the industry is shifting towards system-level scaling, such as heterogeneous integration and chiplet technologies.
Global industry leaders will discuss key topics, including Heterogeneous Integration Roadmaps, SiP, Chiplets for AI/HPC, and the latest in advanced packaging materials and technologies.