X-ray Radiography is a non-destructive failure analysis technique used to examine interior details, essential for IC package and PCB board failure analysis.
The technique relies on the fact that X-ray penetration varies according to the type of material and thickness. By subjecting the device to penetrating X-rays, a resulting image is produced on a photographic film or on a screen (for real time X-ray). The recorded radiograph or shadow image shows the differences in density due to the internal material variations in the device. This method is highly effective for detecting interconnect defects, die attach voids, package voids and cracks within the plastic sealed package.