UTAC Group provides a diverse range of packaging solutions, including WLCSP, power applications, analog, mixed-signal, and wireless communication packages.
Each package type has unique electrical characteristics that impact signal and power integrity.
To ensure optimal interconnect performance, device-specific electrical modeling and characterization are essential. UTAC Group’s expertise and advanced simulation capabilities are designed to meet the evolving demands of modern packaging solutions, including cutting-edge technologies. Our electrical analysis encompasses the entire process—from pre-layout design and optimization to package performance verification and reliability assessment.